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- Stieglitz, T.; Schüttler, M.; Koch, Klaus-Peter
- Neural prostheses in clinical applications : trends from precision mechanics towards biomedical microsystems in neurological rehabilitation = Neuroprothesen in der klinischen Anwendung
- Biomedizinische Technik = Biomedical engineering. Bd. 49. H. 4. Berlin: De Gruyter [u.a.] 2004 S. 72 - 77
- Nyak, Laxman; Koch, Klaus- Peter (Saliwell Study Group)
- The burden of xerostomia in indepedent community-dwelling older adults : results from the Saliwell projekt
- Oral biosciences and medicine : from molecule to mouth ; OBM. Bd. 1. H. 4. New Malden: Quintessence Publ. 2004 S. 283 - 289
- Stieglitz, T.; Monz, D.; Koch, Klaus Peter
- Über die Zell-Material-Schnittstelle von Neuroprothesen
- MP materials testing : Materialprüfung ; materials and components, technology and application. Bd. 47. H. 3. München: Hanser 2005 S. 101 - 105
- Stieglitz, T.; Schuetter, M.; Koch, Klaus Peter
- Implantable biomedical microsystems for neural prostheses
- IEEE engineering in medicine and biology magazine. Bd. 24. H. 5. New York, NY: IEEE 2005 S. 58 - 65
- Koch, Klaus Peter
- Integrated neural interfaces arrays for neuroprosthetics applications
- Nanomedicine. Bd. 1. H. 3. 2005 S. 250 - 251
- Koch, Klaus Peter
- Schnittstelle zwischen Biologie und Technik: Implantierbare Mikroelektroden
- Inno. Bd. 31. 2005 S. 8 - 9
- Ramachandran, Anup; Schüttler, Martin; Lago, Natalia et al.
- Design, in vitro and in vivo assessment of a multi-channel sieve electrode with integrated multiplexer
- Journal of neural engineering. Bd. 3. H. 2. 2006 S. 114 - 124
- Hoffmann, K.-P.; Carrozza, M.; Micera, S. et al.
- Neuroprothesen - implantierbare Mikrosysteme auf der Grundlage von Methoden der Neurobionik
- Orthopädie-Technik. Bd. 57. H. 5. Dortmund [u.a.]: Verl. Orthopädie-Technik 2006 S. 334 - 339
- Guiraud, David; Koch, Klaus Peter; Divoux, Jean-Louis et al.
- An implantable neuroprosthesis for standing and walking in paraplegia: 5-year patient follow-up
- Journal of neural engineering. Bd. 3. H. 4. 2006 S. 268 - 275
- Ramachandran, Anup; Junk, Michael; Koch, Klaus Peter et al.
- A study of Parylene C polymer deposition inside microscale gaps
- IEEE transactions on advanced packaging. Bd. 30. H. 4. New York: IEEE 2007 S. 712 - 724