Prof. Dr. Monika Saumer
Fachbereich Informatik und Mikrosystemtechnik, Hochschule Kaiserslautern
- 0631/3724-5420
- 0631/3724-5305
Saumer, M.; Buhleier, N.; Shi, X. et al.
Micro structuring of Si and PDMS templates and their application for microbe cultureInternational Conference on Advanced Manufacturing for Multifunctional Miniaturised Devices. Zweibrücken. 2013
Theis, Martin; Ediger, Simon; Schmitt, Martin Tobias et al.
Nanocrystalline electroplated NiFe-based alloys for integrated magnetic microsensorsphysica status solidi (a). Bd. 210. H. 5. Wiley 2013 S. 853 - 858
Greß, C.; Jeziorski, M.; Saumer, M. et al.
Simulation of in-vivo-equivalent epithelial barriers using a micro fluidic deviceBiomedical Microdevices. Bd. 16. H. 2. Springer Nature 2013 S. 191 - 198
Wu, Bin; Braun, Anne; Ediger, Simon et al.
Surface quality and biocompatibility of porous hydroxyapatite scaffolds for bone tissue engineeringphysica status solidi (a). Bd. 210. H. 5. Wiley 2013 S. 957 - 963
Saumer, M.; Xudian, Sh.; Buhleier, N. et al.
Wet Etching Method to Fabricate Patterned Biochips for MicrobesInternational Conference on Advanced Manufacturing for Multifunctional Miniaturised Devices. Zweibrücken. 2013
Saumer, Monika; Arnold, David P.; Yoon, Yong-Kyu
Additive Processes for MetalsGhodssi, Reza ; Lin, Pinyen (Hrsg). MEMS Materials and Processes Handbook. Boston, MA: Springer US 2011 S. 137 - 191
Giro, F.; Bedner, K.; Dhum, Christian et al.
Pulsed electrodeposition of high aspect-ratio NiFe assemblies and its influence on spatial alloy compositionMicrosystem technologies. Bd. 14. H. 8. Berlin [u.a.]: Springer 2008 S. 1111 - 1115
Hoffmann, Joachim Ernst; Bedner, K.; Clemens, Helmut et al.
The influence of the electroplating parameters on the conditions of deposited nickel-iron coatingsMaterialwissenschaft und Werkstofftechnik. Bd. 39. H. 3. Weinheim: Viley-VCH 2008 S. 209 - 216
Allen, D. M.; Duclos, N.; Garbutt, I. et al.
The effects of additives on the physical properties of electroformed nickel and on the stretch of photoelectroformed nickel componentsBlanton, Shawn (Hrsg). DTIP of MEMS & MOEMS :design, test, integration and packaging of MEMS/MOEMS 2006 :design, test, integration and packaging of MEMS/MOEMS 2006 : [Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2006 ; 26 - 28 April 2006, Stresa, Lago Maggiore, Italy]. Grenoble: TIMA Eds. 2006 S. 316 - 321